Sn-Mg lead-free solder alloy: Effect of solidification thermal parameters on microstructural features and microhardness

Materials Research Express v. 6, n. 12, p.126562, 2019 1.449 10.1088/2053-1591/ab58f9 Cruz, C. B. da; Lima, T. S.; Costa, T. A.; Brito, C. C.; Garcia, A.; Cheung, N. 2019