Interrelationship of thermal parameters, microstructure and microhardness of directionally solidified Bi-Zn solder alloys

Microelectronics Reliability v. 78, p. 100-110, 2017 1.371 10.1016/j.microrel.2017.08.007 Septimio, R. S.; Costa, T. A.; Vida, T. A.; Garcia, A.; Cheung, N. 2017