LNNano - Brazilian Nanotechnology National Laboratory

See bellow all facilities available at the Microfabrication Laboratory:

 

1. PATTERN TRANSFER

Heidelberg µpg 101 Table Top Laser Pattern Generator

The equipment is a table top capable of generating patterns as thin as 3 µm. The µPG 101 is an extremely economical and easy to use micro pattern generator for direct writing applications and low volume mask making. It can also be used for direct writing on wafers (Silicon and other materials). It basically works like a desktop printer with a resolution of 250,000dpi. The system can be used for applications like MEMS, BioMEMS, Integrated Optics, Micro Fluidics or any other application that requires high precision, high resolution microstructures. Features of this equipment follow highlighted below:

  • Substrates Dimensions from 2” to 5”, maximum thickness 6mm, flatness < ± 20μm.
  • Structures down to 3 μm.
  • Multiple data input formats (DXF, CIF, GDS, BMP).
  • Camera system for alignment.
  • Resists: S18XX, AZ15XX, AZ45XX, AZ92XX, SU-8

Karl Suss MJB3 – Mask Aligner

  • Capable of processing wafers up to 3-inch.
  • Configured for Top Side Alignment (TSA).
  • 350W Lamphouse.
  • Exposure Resolution: 1.5um (under optimal conditions).
  • Alignment Resolution: 0.25um (operator dependant).
  • Capable of Hard, Soft and Vacuum Contact Exposure Modes.

 

3D printer: Formlabs (Form 2 3D Printer)

  • Technology:  stereolithography (SLA).
  • Peel Mechanism: sliding Peel Process with wiper.
  • Resin Fill System: Automated.
  • Build Volume:145 × 145 × 175 mm.
  • Material: Methacrylate Photopolymer Resin.
  • Layer thickness: 25 – 100 microns.
  • Laser spot size:140 microns.
  • Laser power: 250 mW.

 

3D printer: Sethi3D (AiP 3D Printer)

  • Technology:  Extrusion printer of fused deposition modelling (FDM).
  • Stainless steel nozzle with 0.4 mm output.
  • Layer thickness: 0.05 – 0.3 mm.
  • Printing area: 220mm x 210mm x 200mm.
  • Filament diameter: 1.75 mm filament.
  • Filament materials: ABS, PLA, PETG.

 

2. THIN FILM DEPOSITION

Sputtering DC/RF: Balzers (BA510) plasma-beam DC sputtering system

  • Process material: usually Cr, Ti, Au, Al, Cu, Ni, Fe, Pt, Pd, NiFe, WTi, …
  • Wafer size: 7-inch (maximum).
  • Substrate heating.
  • High density plasma-beam.
  • Four-targets.
  • Base pressure: 2×10-7 mbar.
  • Thickness control: Crystal sensor.
  • Reactive sputtering (O2 and N2).

Sputtering DC/RF: Leybold (Z400) RF sputtering system

  • Process material: usually SiO, SiO2, Ti, TiO2, Pt and Au.
  • Wafer size: 2-inch (maximum)
  • Base pressure: 2×10-6 mbar
  • Three-targets

Electron Beam Leybold Univex 300

  • Process Material: usually Ag, Al, Ti, Cr, Ni, Fe, SiO2, TiO2, Au.
  • Wafer size: 5.5-inch (maximum).
  • E-beam power source: 4KW.
  • Base pressure: 2×10-6 mbar.
  • Thickness control: Crystal sensor.

Electrondeposition

  • Process material: Cu, Au and Ni.
  • Wafer size: up to 3-inch.

VacuTec Plasma System PECVD – Dual Chamber for dielectric deposition

  • Process material: SiO2, Si3N4.
  • Wafer size: 3-inch (maximum).
  • Sustrate Heating: up to 400 °C.
  • RF generator: 600W, 13.56 MHz.
  • Four-gas line.

VacuTec plasma system PECVD – Dual chamber acting as plasma etching – Reactive ion etching (RIE-PE)

  • Anisotropic etching.
  • Process material: oxides, dielectric and semiconductors.
  • RF generator: 600W, 13.56 MHz.
  • Four-gas line.

 

3. SURFACE TREATMENT

Barrel Asher Plasma Technology SE80 – Oxygen Plasma

  • RF generator: 300W, 13.56 MHz.
  • Wafer size: 8-inch (maximum).
  • Three-gas line: O2, N2 and Ar.

Rapid Thermal Annealing (RTA) – HeatPulse 410

  • Wafer size: 3-inch.
  • Substrate heating: up to 1100 °C.
  • Gas proccess: N2, Ar, O2, …

 

4. SURFACE INSPECTION

Profilometer Dektak-150

  • Wafer size: 4-inch (maximum).
  • Vertical range: up to 1mm.
  • X-Y automatic stage.
  • Vertical resolution: 1 Angstron (maximum).
  • 3D Mapping with Vision analysis software.

Other techniques

  • Mitutoyo IDS Digital Indicators.
  • MicroNal Binocular Microscope.
  • Olympus Optical Microscope.
  • Zeiss Optical Microscope.
  • Veeco Dektak- ST profilometer.

 

5. ANALYTICAL INSTRUMENTATION

Potentiostat/galvanostat Autolab (PGSTAT302N)

  • Electrode connections: 2, 3, and 4.
  • Potential range: +/- 10 V.
  • Compliance voltage: +/- 30 V.
  • Maximum current: +/- 2 A.
  • Current ranges: 1 A to 10 nA (100 pA with ECD module).
  • PC interface: USB.
  • Control software: NOVA.
  • Extra Modules: FRA32M and ECD.

Potentiostat Dropsens (µSTAT 4000P)

  • 4 independent potentiostats.
  • One multichannel that can act as a potentiostat where up to 4 working electrodes share an auxiliary and a reference electrode.
  • Voltammetric or Amperometric measurements.
  • Potential range: +/- 4 V.
  • Maximum currente: +/- 80 Ma.
  • Current ranges: 1 nA to 100 mA .
  • PC interface: USB and Bluetooth®.
  • Powered by Li-ion Battery.
  • Dimensions: 22.2 cm x 20.5 cm x 7.5 cm (L x W x H).
  • Weight: 1.6 kg.

Multimeter Agilent 34410A/11A 6 ½ Digit Multimeter

  • Voltage and Current Measurements: DC and AC(true-rms).
  • Resistance Measurements: 2-wire and 4-wire.
  • Continuity and Diode Testing.
  • Frequency and Period Measurements.
  • Capacitance Measurements.
  • Temperature Measurements: Thermistor and RTD.
  • Auto and Manual Ranging.